Chemical Mechanical Polisher
TMP-150/200
This series is CMP polishing equipment suitable for thin film (dielectric layer), including the planarization polishing of oxides, metals, STI, SOI, MEMS, and other products. The air bag film is used for flexible pressurization to realize nanoscale precision removal. The semi-automatic chip loading and unloading, and friction-torque EPD functions are optional, resulting in strong compatibility and small space requirements.
Wafer Size4/6 inch
Plate SpecificationsOD406 mm
Wafer Airbag Pressure70-500 g/cm2
Holding Ring Pressure70-700 g/cm2
